Nexperia Expands BJT Portfolio with 12 New Devices in Compact CFP15B Packages for Automotive and Industrial Applications

Release time:Jul 29, 2025
Views:99
Author:Vivi
Nexperia has unveiled 12 new MJD-type bipolar junction transistors (BJTs) housed in the compact Clip-Bonded FlatPower (CFP15B) package, expanding its robust BJT lineup. The newly launched MJPE series is tailored to address the ongoing demand for more energy-efficient and cost-effective designs in industrial and automotive sectors. Compared to conventional DPAK-packaged MJD transistors, the CFP15B versions offer significant PCB space savings and cost advantages—without sacrificing performance.
 
The lineup includes six automotive-grade devices (e.g., MJPE31C-Q) and six industrial-grade options (e.g., MJPE44H11), with V<sub>CEO</sub> ratings of 50 V, 80 V, and 100 V and collector current (I<sub>C</sub>) ratings of 2 A, 3 A, and 8 A. Both NPN and PNP types are available. These BJTs complement Nexperia’s growing CFP-based portfolio, which already includes various Schottky and fast-recovery power diodes—contributing to the company’s vision of packaging standardization across product categories, simplified PCB layouts, and streamlined supply chains.
 
BJTs in the CFP15B package are well-suited for applications such as battery management system (BMS) power supplies, EV onboard chargers, and backlighting in video displays. They retain thermal performance equivalent to DPAK variants—with an operating junction temperature of up to 175°C for automotive use—while reducing the soldering footprint by 53%. Additionally, the clip-bonded structure of the CFP15B package enhances both thermal and electrical characteristics while delivering superior mechanical strength.
 
Frank Matschullat, Nexperia’s Product Group Manager for Power Bipolar Discretes, noted:“As industries increasingly adopt multilayer PCBs—driven by the proliferation of high-performance microcontrollers—packaging has become an integral part of thermal management. Our modern CFP packaging technology, designed specifically for multilayer boards, enables comparable electrical performance in a smaller form factor, helping reduce both part and total system costs. To meet surging demand, Nexperia has significantly expanded production capacity for CFP-packaged devices. These MJPE BJTs are a vital part of future-proof automotive and industrial systems.”
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