Nexperia Introduces New 100 V AEC-Q101 Qualified MOSFETs in Compact CCPAK1212 Copper-Clip Package for High-Power 48 V Automotive Applications

Nexperia has announced the release of a new range of 100 V MOSFETs that meet AEC-Q101 automotive qualification standards and feature the company’s compact CCPAK1212 (12 x 12 mm) copper-clip package. With an exceptionally low on-resistance (R_DS(on)) of just 0.99 mΩ and a safe operating current exceeding 460 A, these devices are engineered to handle the demanding thermal and electrical conditions found in high-performance 48 V automotive systems such as on-board chargers (OBCs), traction inverters, and battery management systems (BMS). Beyond passenger vehicles, these MOSFETs are also ideal for two- and three-wheeler EVs, DC-DC converters, and industrial high-current modules where efficiency and thermal reliability are equally critical.

 

As automotive OEMs continue migrating from 12 V to 48 V subsystems to enhance efficiency, reduce weight, and extend range across electrified platforms, minimizing conduction losses has become increasingly important. Designers often achieve this by paralleling multiple MOSFETs, but this approach adds complexity, increases component count, and consumes valuable PCB space. Nexperia’s CCPAK1212 MOSFETs deliver ultra-low R_DS(on) and high power density, significantly reducing the need for parallel devices. Their compact footprint also provides up to 40% PCB area savings compared with traditional TOLL or TOLT packages.

 

Built on Nexperia’s next-generation 100 V trench silicon platform and leveraging the superior thermal performance of the proprietary CCPAK1212 copper-clip package (R_th(jb) = 0.1 K/W), these MOSFETs combine extremely low conduction losses with high robustness. Together, these features deliver exceptional benefits for 48 V automotive systems—including high current capability, excellent power density, and a rugged 400 A / 100 V Safe Operating Area (SOA).

 

To maximize design flexibility, the new MOSFETs are available in both top-cooled (CCPAK1212i) and bottom-cooled (CCPAK1212) versions, giving engineers the freedom to optimize layout and thermal management based on specific system requirements.