The Future of Advanced Packaging: How DLP Technology Is Powering the Next Wave of Semiconductor Innovation

As the race to develop powerful, energy-efficient chips for Artificial Intelligence (AI), the Internet of Things (IoT), and 5G networks accelerates, the demand for greater computing performance continues to grow.

For decades, the electronics industry has relied on Moore’s Law — the principle that the number of transistors on a chip doubles roughly every two years — driving exponential performance gains and ever-smaller components.

However, according to Jeff Marsh, Vice President and General Manager of TI’s DLP Products, “We’ve reached a point where further shrinking component sizes is becoming increasingly difficult and costly.”

To overcome these limitations, system manufacturers are turning to advanced packaging — an approach that integrates multiple chips within a single package. This allows faster communication between chips while reducing power consumption. By combining the best components for specific tasks and connecting them efficiently to printed circuit boards, advanced packaging enables more powerful and energy-efficient chips for applications like data centers and autonomous driving.

 

Making Lithography More Scalable and Cost-Effective

Advanced packaging represents the next evolution in semiconductor manufacturing. Yet to realize its full potential, manufacturers must make lithography — the process used to print intricate circuit patterns — more affordable, scalable, and precise. Many are now exploring digital lithography powered by DLP (Digital Light Processing) technology to achieve these goals.

At the heart of this innovation lies the Digital Micromirror Device (DMD) — containing up to 8.9 million microscopic mirrors that can direct light in real time to print patterns on materials with exceptional precision.

 

Precision Meets Adaptability

Traditional lithography uses physical masks — similar to high-end templates — to project patterns onto light-sensitive surfaces. However, as advanced packaging introduces more variation in surface topography, maskless lithography has emerged as a more cost-effective and flexible alternative.

“DLP technology continuously adapts the projected pattern to match the actual surface condition of the material,” says Marsh. “Its real-time responsiveness ensures accuracy even on non-flat surfaces.”

With DLP, manufacturers can instantly update patterns directly from digital files without fabricating new masks. Engineers simply modify the software, enabling faster design cycles, less waste, and more sustainable manufacturing.

“Whether manufacturers are developing compact printers for smartphones or large-scale systems for data centers,” Marsh adds, “the same DLP core technology delivers precision and scalability across applications.”

 

Enabling the Next Generation of Innovation

Rooted in its legacy of revolutionizing the movie industry — from film projection to digital cinema — TI’s DLP technology is now redefining what’s possible in semiconductor manufacturing.

“We’re enabling the creation of maskless digital lithography systems that empower engineers to bring next-generation computing solutions to market,” says Marsh. “Interestingly, the very first DMD chip we designed decades ago was for printing, before it became central to display technology. Today, we’re returning to those roots — but with cutting-edge innovation.”

From data centers to autonomous vehicles, digital lithography systems powered by DLP technology are laying the groundwork for advanced packaging solutions that will fuel the next era of high-performance computing.

As Marsh concludes, “At the end of the day, it’s all about empowering the technologies that truly make a difference.”